Semiconductor
Mid-end Inspection

Integrated Measurement System

Semiconductor Mid-end
Visual Inspection

INTEKPLUS's WSI (White Light Scanning Interferometer) 3D optical system is an optimal inspection solution for fine pitch bumps required for high-end products. FC-Substrate, FO-PLP, Wafer, and the performance of the equipment have been verified through bump inspection of various products.

INTEKPLUS is responding by partnering with global leader companies that are continuing various trials and developments, and the experience is the best Spec. It is becoming the foundation for realizing further customer satisfaction.

Package Substrate Bump AOI
From high-end products that require high inspection performance for fine pitch to middle-end products that increase productivity, global leaders have chosen INTEKPLUS's BAOI for FC-Substrate.
  • Inspection Targets

    FC-BGA, Panel, FC-CSP

  • Inspection Items

    Bump Height, Bump Area Warpage, Bump Coplanarity, Thickness Valuation, Bump Diameter, Etc.

  • Model

    iSIS-NBGA (In-tray inspection for Flip-chip BGA)

    iSIS-NTV (Suction jig inspection for Flip-chip BGA)

    iSIS-QPM(Full-Panel/Q-Panel inspection)

    iSIS-NCSP (Flip-chip CSP inspection)

iSIS-NBGA
Bump-AOI for FC-BGA Unit inspection. The tray containing the unit is loaded into the loader and automatically sorted after inspection and discharged to the unloader.
  • 3D Method
    WSI
  • Height Accuracy
    ±1µm
  • Inspection Stage
    In-Tray
iSIS-NTV
Bump-AOI for FC-BGA Unit Inspection. 3D Inspection executes with Suction Jig which is high-precise flatness for Thickness Valuation Inspection.
  • 3D Method
    WSI
  • Height Accuracy
    ±1µm
  • Inspection Stage
    3D on Suction jig
iSIS-QPM
Bump-AOI for Full-Panel/Q-Panel Inspection that is manual loading type and used for various purposes as prototype/test product rather than mass product. Moreover, it's able to operate as automation mode by docking EFEM.
  • 3D Method
    WSI
  • HeightAccuracy
    ±1µm
  • L/UL
    Manual / EFEM
iSIS-NCSP
Bump-AOI for FC-CSP Strip Inspection. Unit comes out to unloader after inspecting magazine including strip onto loader.
  • 3D Method
    WSI
  • Height Accuracy
    ±1µm
  • Inspection Stage
    Suction jig
Wafer / PLP Bump AOI
For wafers, especially PLP, each company has its own process. INTEKPLUS's equipment is not only high in Resolution Spec., but also has proven inspection performance on various types of surfaces.
  • Inspection Targets

    FC-BGA, Panel, FC-CSP

  • Inspection Items

    Bump Height, Bump Area Warpage, Bump Coplanarity, Thickness Valuation, Bump Diameter, Etc.

  • Model

    iSIS-FP3D (Wafer, PLP inspection)

iSIS-FP3D
Bump-AOI for Wafer and PLP. Manual loading method or Possibly EFEM docking.
  • 3D Method
    WSI
  • Height Accuracy
    ±1µm
  • L/UL
    Manual / EFEM