Semiconductor
Backend Visual Inspection

Integrated Measurement System

Semiconductor Backend
Visual Inspection

Micro Vision Technology thoroughly inspects the microscopic and complex semiconductor packaging process.

INTEKPLUS's excellent Vision Technology, selected by Global Semiconductor manufacturers, provides the best inspection solution in the Semiconductor backend visual inspection process.

Semiconductor Package Inspection System

iPIS Product Family
  • iPIS-HX Series
    HIGH DETECTABILITY
    HEXA PLATFORM

    Premium Solution of Supporting
    6 Sides Inspection (Top/Bottom
    2D/3D, 4 Side)

    High Detectability for Advanced
    Package Inspection (SiP, CIS ···)

    Supports Advanced Inspection
    Options: Real Total Height (Top 3D),
    Top Side Dent, Side LFF Stitching,
    Multi Picker and Deep Learning

    Related Model : 140HX, 240HX,340HX
  • iPIS-XTR Series
    EXTENDABILITY
    TR PLATFORM

    All-in-one Inspection Solution
    with 3 Rail for 6 Side + Tape & Reel

    Cost-effective Upgrades which
    enable to extend Equipment
    Lifecycle

    Maximized Extension Capability

    Selective Inspection Available for
    Customer Inspection Needs
    (Advanced Package, Side
    Inspection)

    Related Model : X140TR, X240TR,X340TR
  • iPIS-IN Series
    IN-TRAY PLATFORM
    INSTANT INSPECTION

    World Best Productivity Supporting
    In-tray Handling method with 5 Rail
    Based Platform

    Minimize the Handing Damage with
    Tray Flipping Technology

    Stable Handing with Precise
    Stitching for Large Packages

    Option: HX Platform, Tape & Reel

    Related Model : 380, 560, 580
iPIS-HX Series
Ultra-high-resolution vision solution and precision high-speed Pick & Place handling technology provide high productivity and detectability.
  • Inspection Stage
    2D Vision

    Top / Bottom / 4 Sides

    3D Vision

    Top / Bottom

  • General Specification
    Inspection PKG

    TSOP/ LDP/ QFP/ BGA/
    BOC/ QFN/ usD CARD etc.

    UPH

    Max 80K

    Package Size

    2x2mm ~ 120x120mm

  • Extension
    Hexa(HX)
  • Related Model

    iPIS-140HX

    iPIS-240HX

    iPIS-340HX

iPIS-HX series
HIGH DETECTABILITY
HEXA PLATFORM
Related Model :
140HX, 240HX, 340HX

Premium Solution of Supporting 6 Sides Inspection
(Top/Bottom 2D/3D, 4 Side)

High Detectability for Advanced Package Inspection
(CIS,SiP, Heterogeneous Integration)

Supports Advanced Inspection Options :
Real Total Height (Top 3D), Top Side Dent,
Side LFF Stitching , Multi Picker and Deep Learning

[iPIS-HX Series Standard Features]

  • Pick & Place
    Handling
    Method

  • UPH
    Max 80K

  • Top 2/3D
    Bottom 2/3D,
    4 Side

  • Advanced
    Package

  • Direct View
    Mechanism

  • LFF Stitching
    120x120

[iPIS-HX Series Advanced Features]

  • Real Total
    Height

  • Deep
    Learning

  • Multi
    Picker

iPIS-240
[iPIS-240 Standard Features]
  • Handling Method
    Pick & Place
  • UPH
    MAX 70K
  • Inspection
    Top/Bottom
    2D/3D
  • Package
    Advanced
    Package
  • LFF
    Stitching
    85x85
  • LTSM
    Long-term Stability Monitoring
[HX Extension Features]
  • Extension 1
    4 Side 2D
  • Extension 2
    Side LFF
    Stitching
  • Extension 3
    Direct View Mechanism
[Other Advanced Features]
  • Feature 1
    Top 3D
    (Real Total Height)
  • Feature 2
    Deep Learning
iPIS-140
[iPIS-140 Standard Features]
  • Handling Method
    Pick & Place
  • UPH
    MAX 60K
  • Inspection
    Top/Bottom
    2D/3D
  • Package
    Advanced
    Package
  • LFF
    Stitching
    80x80
  • LTSM
    Long-term Stability Monitoring
[HX Extension Features]
  • Extension 1
    4 Side 2D
  • Extension 2
    Side LFF
    Stitching
  • Extension 3
    Direct View Mechanism
[Other Advanced Features]
  • Feature 1
    Top 3D
    (Real Total Height)
  • Feature 2
    Deep Learning
iPIS-XTR Series
iPIS-XTR Series is an All-in-one inspection solution that integrates Machine Vision Inspection System and Conventional Tape & Reel Handler.
Auto Reel Changer enables further extended to achieve Full Automation of the Post Reel Process.
  • Inspection Stage
    2D Vision

    Top / Bottom / 4 Sides

    3D Vision

    Top / Bottom

  • General Specification
    Inspection PKG

    TSOP/ LDP/ QFP/ BGA/
    BOC/ QFN/ usD CARD etc.

    UPH

    Max 70K

    Package Size
  • Extension

    Auto Reel Changer(ARC)

  • Related Model

    iPIS-X140TR

    iPIS-X240TR

    iPIS-X340TR

iPIS-XTR Series
EXTENDABILITY
TR PLATFORM
Related Model :
X140TR, X240TR, X340TR

All-in-one Inspection Solution with 3Rail for 6 Side + Tape & Reel

Cost-effective Upgrades which enable to extend Equipment Lifecycle

Maximized Extension Capability

Selective Inspection Available for Customer Inspection
Needs(Advanced Package, Side Inspection)

[iPIS-XTR Series Standard Features]

  • Pick & Place
    Handling
    Method

  • UPH
    Max 70K

  • Bottom
    2/3D,
    Top 2D

  • Tape &
    Reel
    Extension

  • Direct View
    Mechanism

  • Vision
    Extension
    Available

[iPIS-XTR Series Advanced Features]

  • Multi Picker

  • Deep
    Learning

  • Auto Reel
    Changer

Auto Reel Changer

Auto Reel Changer enables to automate Reel Taping,
Barcode Label Attach and Protection Bander attaching,
which was inevitable by the operator.

[Auto Reel Changer Features]
  • Reel Taping
  • Barcode Label Attach
  • Label Printer
  • Dual Reel Changer
  • Protection Bander
  • Finished Reel Stacker
iPIS-IN Series
iPIS-IN Series performs visual inspection while the semiconductor package is mounted on the tray.
Our advanced Tray flipping technology materializes fast and accurate inspection without package damage.
  • Inspection Stage
    2D Vision

    Top / Bottom / 4 Sides

    Top / Bottom
  • General Specification
    Inspection PKG

    TSOP/ LDP/ QFP/ BGA/
    BOC/ QFN/ usD CARD etc.

    UPH

    Max 100K

    Package Size

    3×3mm ~ 120×120mm

  • Extension

    Hexa(HX) / Tape & Reel (TR)

    Auto Reel Changer(ARC)

  • Related Model

    iPIS-380

    iPIS-560

    iPIS-580

iPIS-IN Series
IN-TRAY PLATFORM
INSTANT INSPECTION
Related Model :
380, 560, 580

World Best Productivity Supporting In-tray Handling method with 5 Rail Based Platform

Minimize the Handling Damage with Tray Flipping Technology

Stable Handling with Precise Stitching for Large Packages

Option: HX Platform, TR

[iPIS-IN Series Standard Features]

  • In-tray
    Handling
    Method

  • UPH
    Max 100K

  • Bottom
    2/3D,
    Top 2/3D

  • 2D/3D LFF
    Stitching

  • Tray
    Flipping
    Technology

  • Auto
    Sorting
    System

[iPIS-IN Series Advanced Features]

  • HX
    Platfom

  • Tape &
    Reel

  • Side LFF
    Stitching

  • Deep
    Learning

iPIS-560
TR
[iPIS-560 Standard Features]
  • Handling Method
    In-tray
  • UPH
    MAX 85K
  • Inspection
    Top/Bottom
    2D/3D
  • LFF
    2D/3D
    Stitching
  • Damage
    Damage
    Free
  • Sorting
    Auto System
[HX Extension Features]
  • Extension 1
    4 Side 2D
  • Extension 2
    Side LFF
    Stitching
[Other Advanced Features]
  • Feature 1
    Deep Learning
  • Feature 2
    Tape & Reel
iPIS-380
TR
[iPIS-380 Standard Features]
  • Handling Method
    In-tray
  • UPH
    MAX 100K
  • Inspection
    Top/Bottom
    2D/3D
  • LFF
    2D/3D
    Stitching
  • Damage
    Damage
    Free
  • Sorting
    Auto System
[HX Extension Features]
  • Extension 1
    4 Side 2D
  • Extension 2
    Side LFF
    Stitching
[Other Advanced Features]
  • Feature 1
    Deep Learning
  • Feature 2
    Tape & Reel
Memory Module/SSD AVI
INTEKPLUS's Memory Module FVI Inspection platform inspects the visual defects of memory modules.
Real-time 3D inspection through optical triangulation provides inspection of products of various sizes.
  • Memory Module
    SSD AVI
  • Inspection Stage
    iMAS-2000

    DIMM, SODIMM, FBDIMM

    iSSD-Q1000D

    2.5” SATA, mSATA, RAID LIF, Gumstick1, Gumstick2

  • General Specification

    Top/Bottom 2D&3D

    Top/Bottom 2D&3D
    Side 2D

  • Extension

    2,000 EA
    (@SODIMM)

    6,000 EA
    (@ 2.5” CASE)

  • Model

    - iMAS-2000

    - iSSD-Q1000D

iMAS-2000
[iMAS-2000 Advanced Features]
  • UPH
    Max.2000
  • In-out
    Direct Tray In-out
  • Review
    Reject Review Station
  • Sorting
    Auto Sorting
  • Light System
    3Band Light System
  • Job Teaching
    Fast Job Teaching
iSSD-Q1000D
[iSSD-Q1000D Advanced Features]
  • UPH
    Max.6000
  • Inspection
    5Para Single
    Head Inspection
  • Review
    Reject Review
    Station
  • In-out
    Direct Tray
    In-out
  • Auto Conversion
    Jig Auto Conversion for Inspection
  • Sorting Picker
    Sorting Picker
  • Light
    3Band Light System
  • Job Teaching
    Fast Job Teaching
  • Sorting
    Auto Sorting