3D Technology
-
Integrated Measurement System
3D Technology
Large FOV White light Scanning Interferometer
(White Light Scanning interferometer)
Large FOV
High Speed Camera &
High Speed Image processing module
Special Illumination Technique
- INTEKPLUS’s LWSI
- In order to apply the 3D measurement precision of the WSI optical system to the mass production process of high-end products, we developed the LWSI optical system with improved WSI. A high-resolution camera, special beam splitter and lighting, and a dedicated Image Processing Modules are used to complete a system that adds productivity to high inspection performance.
-
Single Camera
Slit Beam Scanning (General Type)
-
Dual Camera
Slit Beam Scanning (INTEKPLUS Patent)Dual Slit Beam Metrology, patented by INTEKPLUS, measures true 3D of all inspection areas without hidden areas.
-
Semiconductor PKG
-
Semiconductor PKG
INTEKPLUS's advanced Phase Measurement Profilometry equipped with a powerful algorithm precisely detects micro defects in a wide areas such as the body surface.
INTEKPLUS' Stereo Camera Triangulation Metrology combines Real Time image processing technology and powerful algorithms to measure true 3D in real time, regardless of object reflection and color.
-
Real 3D Image + Z map
-
Z map
-
Real 3D Image + Z map
-
Z map
